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 HA16116FP/FPJ, HA16121FP/FPJ
Switching Regulator for Chopper Type DC/DC Converter
REJ03F0056-0200Z (Previous: ADE-204-019A) Rev.2.0 Sep.18.2003
Description
HA16116FP/FPJ and HA16121FP/FPJ are dual-channel PWM switching regulator controller ICs for use in chopper-type DC/DC converters. This IC series incorporates totem pole gate drive circuits to allow direct driving of a power MOS FET. The output logic is preset for booster, step-down, or inverting control in a DC/DC converter. This logic assumes use of an N-channel power MOS FET for booster control, and a P-channel power MOS FET for step-down or inverting control. HA16116 includes a built-in logic circuit for step-down control only, and one for use in both step-down and inverting control. HA16121 has a logic circuit for booster control only and one for both step-down and inverting control. Both ICs have a pulse-by-pulse current limiter, which limits PWM pulse width per pulse as a means of protecting against overcurrent, and which uses an on/off timer for intermittent operation. Unlike conventional methods that use a latch timer for shutdown, when the pulse-by-pulse current limiter continues operation beyond the time set in the timer, the IC is made to operate intermittently (flickering operation), resulting in sharp vertical setting characteristics. When the overcurrent condition subsides, the output is automatically restored to normal. The dual control circuits in the IC output identical triangle waveforms, for completely synchronous configuring a compact, high efficiency dual-channel DC/DC converter, with fewer external components than were necessary previously.
Functions
* 2.5 V reference voltage (Vref) regulator * Triangle wave form oscillator * Dual overcurrent detector * Dual totem pole output driver * UVL (under voltage lock out) system * Dual error amplifier * Vref overvoltage detector * Dual PWM comparator
Rev.2.0, Sep.18.2003, page 1 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Features
* Wide operating supply voltage range* (3.9 V to 40.0 V) * Wide operating frequency range (600 kHz maximum operation) * Direct power MOS FET driving (output current 1 A peak in maximum rating) * Pulse-by-pulse overcurrent protection circuit with intermittent operation function (When overcurrent state continues beyond time set in timer, the IC operates intermittently to prevent excessive output current.) * Grounding the ON/OFF pin turns the IC off, saving power dissipation. (HA16116: IOFF = 10 A max.; HA16121: IOFF = 150 A max.) * Built-in UVL circuit (UVL voltage can be varied with external resistance.) * Built-in soft start and quick shutoff functions Note: The reference voltage 2.5 V is under the condition of VIN 4.5 V.
Ordering Information
Hitachi Control ICs for Chopper-Type DC/DC Converters
Product Channels Dual Number HA17451 Channel No. Ch 1 Ch 2 Single HA16114 HA16120 Dual HA16116 -- -- Ch 1 Ch 2 HA16121 Ch 1 Ch 2 Control Functions Step-Up -- -- -- -- Step-Down -- -- Inverting -- -- -- Totem pole power MOS FET driver Pulse-by-pulse current limiter and intermittent operation by on/off timer Output Circuits Open collector Overcurrent Protection SCP with timer (latch)
Rev.2.0, Sep.18.2003, page 2 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Pin Arrangement
S.GND*1 CT RT IN(+)1 IN(-)1 E/O1 Channel 1 DB1 CL1 OUT1 P.GND *1 S.VIN*2 Vref TIM ON/OFF IN(-)2 E/O2 DB2 CL2 OUT2 P.VIN*2 Channel 2
1 2 3 4 5 6 7 8 9 10 (Top view)
20 19 18 17 16 15 14 13 12 11
Notes: 1. Pins S.GND (pin 1) and P.GND (pin 10) have no direct internal interconnection. Both pins must be connected to ground. 2. Pins S.VIN (pin 20) and P.V IN (pin 11) have no direct internal interconnection. Both pins must be connected to VIN.
Rev.2.0, Sep.18.2003, page 3 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Pin Functions
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol S.GND CT RT IN(+)1 IN(-)1 E/O1 DB1 CL1 OUT1 P.GND P.VIN OUT2 CL2 DB2 E/O2 IN(-)2 ON/OFF TIM Vref S.VIN Function Signal circuitry* ground Timing capacitance (triangle wave oscillator output) Timing resistance (for bias current synchronization) Error amp. noninverting input (1) Error amp. inverting input (1) Error amp. output (1) Dead band timer off period adjustment input (1) Overcurrent detection input (1) PWM pulse output (1) Output stage* ground Output stage* power supply input PWM pulse output (2) Overcurrent detection input (2) Dead band timer off period adjustment input (2) Error amp. output (2) Error amp. inverting input (2)*
2 1 1 1
Channel 1
Channel 2
IC on/off switch input (off when grounded) Setting of intermittent operation timing when overcurrent is detected (collector input of timer transistor) 2.5 V reference voltage output Signal circuitry* power supply input
1
Notes: 1. Here "output stage" refers to the power MOS FET driver circuits, and "signal circuitry" refers to all other circuits on the IC. Note that this IC is not protected against reverse insertion, which can cause breakdown of the IC between VIN and GND. Be careful to insert the IC correctly. 2. Noninverting input of the channel 2 error amp is connected internally to Vref.
Rev.2.0, Sep.18.2003, page 4 of 33
[Channel 2] Step-down control only (HA16116) Booster control only (HA16121) Vref 19 from UVL to S.VIN -+ CL2 5k Vref UVL H L V L VH from UVL OR OVP UVL output 0.8V + + - PWM COMP 2 OUT2* NAND (HA16116) 0.2 V VIN - EA2 + 18 17 16 15 14 13 12 11 TIM ON/OFF IN(-)2 E/O2 DB2 CL2 OUT2 P.VIN
S.VIN 20
Block Diagram
Rev.2.0, Sep.18.2003, page 5 of 33
VIN Latch S R 0.8V Q - + + Triangle wave oscillator circuit
1.6 V
HA16116FP/FPJ, HA16121FP/FPJ
2.5 V output band gap reference voltage ON/OFF generator circuit
VIN
from UVL
NAND OUT1
0.8V 5k
1.0 V
triangle wave latch reset pulse Bias current 1.1 V RT + EA1 -
PWM COMP 1 Vref 5k from UVL CL1 -+ 0.2 V to S.VIN
from UVL
1 CT ) in the case of RT IN(+)1
2
3
4
5 IN(-)1
6 E/O1
7 DB1 [Channel 1] (HA16116/HA16121) Step-down or inverting control
8 CL1
9 OUT1
10 P.GND
S.GND
Note: * This block is AND ( HA16121.
HA16116FP/FPJ, HA16121FP/FPJ
Function and Timing Chart
Relation between triangle wave and PWM output (in steady-state operation) CT triangle wave Dead band voltage 1.0 V typ E/O Error amp output 1.6 V typ
Booster channel output (HA16121Ch 2) only PWM pulse output
VIN (on) tON
tOFF T
GND (off)
This pulse is for N-channel power MOS FET gate driving.
Step-down or inverting output (HA16116Ch 1, Ch 2/ HA16121-Ch 1)
VIN (off)
GND (on)
This pulse is for P-channel power MOS FET gate driving.
Note: On duty = tON/T, where T = 1/fOSC.
Rev.2.0, Sep.18.2003, page 6 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Determining External Component Constants (pin usage)
Constant settings are explained for the following items.
S.GND 1 Oscillator frequency (fOSC) setting CT 2 RT 3 IN(+)1 4 2. DC/DC converter output voltage setting and error amp usage Dead band duty and soft start setting Output stage circuit and power MOS FET driving method IN(-)1 5 E/O1 6 3. DB1 7 CL1 8 4. OUT1 9 P.GND 10 Channel 1 Channel 2
20 S.VIN 19 Vref 18 TIM 17 ON/OFF 16 IN(-)2 15 E/O2 14 DB2 13 CL2 12 OUT2 11 P.VIN
5.
Vref UVL and OVP
1.
6.
Setting of intermittent operation timing when overcurrent is detected
7.
ON/OFF pin usage
8.
Overcurrent detection value setting
1. Oscillator Frequency (fOSC) Setting Figure 1.1 shows an equivalent circuit for the triangle wave oscillator.
VH 1.6 V typ (3.3 V IC internal circuits)
Vref (2.5 V)
t1
t2
VL 1.0 V typ
CT charging IO
Comparator
RA
RC IO Discharging 1.1 V RT (external) Inside the IC 1:2 RT CT (external) CT RB
Figure 1.1 Equivalent Circuit for the Triangle Wave Oscillator
Rev.2.0, Sep.18.2003, page 7 of 33
HA16116FP/FPJ, HA16121FP/FPJ The triangle wave is a voltage waveform used as a reference in creating a PWM pulse. This block operates according to the following principles. A constant current IO, determined by an external timing resistor RT, is made to flow continuously to external timing capacitor CT. When the CT pin voltage exceeds the comparator threshold voltage VH, the comparator output causes a switch to operate, discharging a current IO from CT. Next, when the CT pin voltage drops below threshold voltage VL, the comparator output again causes the switch to operate, stopping the IO discharge. The triangle wave is generated by this repeated operation. Note that IO = 1.1 V/RT. Since the IO current mirror circuit has a very limited current producing ability, RT should be set to 5 k (IO 220 A). With this IC series, VH and VL of the triangle wave are fixed internally at about 1.6 V and 1.0 V by the internal resistors RA, RB, and RC. The oscillator frequency can be calculated as follows.
fOSC = Here, t1 = t2 = C R (VH - VL) CT (VH - VL) = TT 1.1 V/RT 1.1 V C R (VH - VL) CT (VH - VL) = TT = t1 (2 - 1) x 1.1 V/RT 1.1 V 1 t1 + t2 + t3
VH - VL = 0.6 V t1 = t2 = 0.6 CR 1.1 T T
t3 0.8 s (comparator delay time in the oscillator) Accordingly, fOSC 1 1 [Hz] 2t1 + t3 1.1 CT RT + 0.8 s
Note that the value of fOSC may differ slightly from the above calculation depending on the amount of delay in the comparator circuit. Also, at high frequencies this comparator delay can cause triangle wave overshoot or undershoot, skewing the dead band threshold. Confirm the actual value in implementation and adjust the constants accordingly.
Rev.2.0, Sep.18.2003, page 8 of 33
HA16116FP/FPJ, HA16121FP/FPJ 2. DC/DC Converter Output Voltage Setting and Error Amp Usage 2.1 Positive Voltage Booster (VO > VIN) or Step-Down (VIN > VO > Vref)
Use VO = R1 + R2 Vref (V) R2
Booster output is possible only at channel 2 of HA16121. HA16116 or channel 1 of HA16121 are used.
VO R1 R2 VO R1 IN(-)2 - R2 +
For step-down output, both channels of
Error amp. IN(-)1 - CH1 IN(+)1 +
CH2
Vref pin
Vref 2.5 V (internal connection)
Figure 2.1 2.2 Negative Voltage (VO < Vref) for Inverting Output
Use VO = -Vref R3 + R 4 R1 -1 R3 R1 + R 2 (V)
Channel 1 is used for inverting output on both ICs.
Vref pin R1 R3 IN(+)2 R4 VO Vref 2.5 V IN(-)1 R2 - + Error amp
CH1
Figure 2.2 Inverting Output
Rev.2.0, Sep.18.2003, page 9 of 33
HA16116FP/FPJ, HA16121FP/FPJ 2.3 Error Amplifier Figure 2.3 shows an equivalent circuit of the error amplifier. The error amplifier on these ICs is configured of a simple NPN transistor differential input amplifier and the output circuit of a constant-current driver. This amplifier features wide bandwidth (fT = 4 MHz) with open loop gain kept to 50 dB, allowing stable feedback to be applied when the power supply is designed. Phase compensation is also easy. Both HA16116 and HA16121 have a noninverting input (IN(+)) pin, in order to allow use of the channel 1 error amplifier for inverting control. The channel 2 error amplifier, on the other hand, is used for stepdown control in HA16116 and booster control in HA16121; so the channel 2 noninverting input is connected internally to Vref.
IC internal VIN
IN(-) IN(+) 80 A 40 A
E/O To internal PWM comparator
Figure 2.3 Error Amplifier Equivalent Circuit 3. Dead Band (DB) Duty and Soft Start Setting (common to both channels) 3.1 Dead Band Duty Setting Dead band duty is set by adjusting the DB pin input voltage (VDB). A convenient means of doing this is to connect two external resistors to the Vref of this IC so as to divide VDB (see figure 3.1).
VDB = Vref x Duty (DB) = Here, T = R2 (V) R1 + R2 VTH - VDB x 100 (%) This applies when VDB > VTL. VTH - VTL If VDB < VTL, there is no PWM output. 1 fOSC
Note: VTH: 1.6 V (Typ) VTL: 1.0 V (Typ) Vref is typically 2.5 V. Select R1 and R2 so that 1.0 V VDB 1.6 V.
Rev.2.0, Sep.18.2003, page 10 of 33
HA16116FP/FPJ, HA16121FP/FPJ
To Vref CT VDB R1 DB E/O 5k From UVL
0.8V
VTH VE/O VDB - + + PWM comparator VIN VTL
Booster channel
1.6 V typ
1.0 V typ On tON VIN Off GND VIN GND
tOFF
CST R 2
PWM pulse output Step-down/
inverting channel
Off On T
Figure 3.1 Dead Band Duty Setting 3.2 Soft Start (SST) Setting (each channel) When the power is turned on, the soft start function gradually raises VDB (refer to section 3.1), and the PWM output pulse width gradually widens. This function is realized by adding a capacitor CST to the DB pin. The function is realized as follows. In the figure 3.2, the DB pin is clamped internally at approximately 0.8 V, which is 0.2 V lower than the triangle wave VTL = 1.0 V typ.
tA: Standby time until PWM pulse starts widening. tB: Time during which SST is in effect.
During soft start, the DB pin voltage in the figure below is as expressed in the following equation.
VSST = VDB 1 - e Here, t0.8 = -T ln 1- 0.8 VDB , T = CST (R1 // R2)
-t - t0.8 T
,
tSST = tA + tB
How to select values: If the soft start time tSST is too short, the DC/DC converter output voltage will tend to overshoot. To prevent this, set tSST to a few tens of ms or above.
Rev.2.0, Sep.18.2003, page 11 of 33
HA16116FP/FPJ, HA16121FP/FPJ
V (voltage) Triangle wave VTH
VSST 1.6 V
VTL Starts from clamp voltage of 0.8 V
1.0 V
PWM output pulse starts to widen t0.8 tA tB
Steady-state operation 0V
Booster channel PWM pulse output Step-down/ inverting channel
VIN 0V VIN 0V VO
DC/DC converter output (positive in this example) 0V
t = 0 (here IC is on)
t = tSST
Figure 3.2 Soft Start (SST) Setting
Rev.2.0, Sep.18.2003, page 12 of 33
HA16116FP/FPJ, HA16121FP/FPJ 4. Totem Pole Output Stage Circuit and Power MOS FET Driving Method The output stage of this IC series is configured of totem pole circuits, allowing direct connection to a power MOS FET as an external switching device, so long as VIN is below the gate breakdown voltage. If there is a possibility that VIN will exceed the gate breakdown voltage of the power MOS FET, a Zener diode circuit like that shown figure 4.1 or other protective measures should be used. The figure 4.1 shows an example using a P-channel power MOS FET.
P.VIN
E.g.: VIN = 18 V Zener diode for gate protection
Bias circuit
OUT Gate protection resistor Schottky barrier diode
VO
+ -
Drive circuit
Figure 4.1 P-channel Power MOS FET (example) 5. Vref Undervoltage Error Prevention (UVL) and Overvoltage Protection (OVP) Functions 5.1 Operation Principles The reference voltage circuit is equipped with UVL and OVP functions. * UVL In normal operation the Vref output voltage is fixed at 2.5 V. If VIN is lower than normal, the UVL circuit detects the Vref output voltage with a hysteresis of 1.7 V and 2.0 V, and shuts off the PWM output if Vref falls below this level, in order to prevent malfunction. * OVP The OVP circuit protects the IC from inadvertent application of a high voltage from outside, such as if VIN is shorted. A Zener diode (5.6 V) and resistor are used between Vref and GND for overvoltage detection. PWM output is shut off if Vref exceeds approximately 7.0 V. Note that the PWM output pulse logic and the precision of the switching regulator output voltage are not guaranteed at an applied voltage of 2.5 V to 7 V.
Rev.2.0, Sep.18.2003, page 13 of 33
HA16116FP/FPJ, HA16121FP/FPJ 5.2 Quick Shutoff When the UVL circuit goes into operation, a sink transistor is switched on as in the figure below, drawing off the excess current. This transistor also functions when the IC is turned off, drawing off current from the CT, E/O, and DB pins and enabling quick shutoff.
PWM output On
PWM output off
PWM output on
PWM output off
Off 1.7 2.0 2.5 5.0 7.0 Vref (V)
When VIN is low
Abnormal voltage applied to Vref
Relation of Vref to UVL and OVP VIN Vref
Vref generation circuit
2.0 V and 1.7 V detection ZD 5.6 V R Internal pulse signal line
Vref
UVL
OUT Sink transistor
OUT
OVP
10 k
To other circuitry
Figure 5.1 Quick Shutoff
Rev.2.0, Sep.18.2003, page 14 of 33
HA16116FP/FPJ, HA16121FP/FPJ 6. Setting of Intermittent Operation Timing when Overcurrent is Detected 6.1 Operation Principles The current limiter on this IC detects overcurrent in each output pulse, providing pulse-by-pulse overcurrent protection by limiting pulse output whenever an overcurrent is detected. If the overcurrent state continues, the TIM pin and ON/OFF pin can be used to operate the IC intermittently. As a result, a power supply with sharp vertical characteristics can be configured. The ON/OFF timing for intermittent operation makes use of the hysteresis in the ON/OFF pin threshold voltage VON and VOFF, such that VON - VOFF = VBE. Setting method is performed as described on the following pages. VBE is based-emitter voltage of internal transistor. Note: When an overcurrent is detected in one channel of this IC but not the other, the pulse-by-pulse current limiter still goes into operation on both channels. Also, when the intermittent operation feature is not used, the TIM pin should be set to open state and the ON/OFF pin pulled up to high level (above VON).
VIN 390 k RA TM Vref generation circuit Current limiter CL
Latch S Q R
4.7 k 2.2 F + -
RB
ON/OFF
CON/OFF
Figure 6.1 Connection Diagram (example) 6.2 Intermittent Operation Timing Chart (VON/OFF only)
*1 4VBE c VON/OFF 3VBE 2VBE VBE 0V
c On On Off
IC is on
IC is off
a
b TON t
TOFF 2TON a. Continuous overcurrent detected b. Intermittent operation starts (IC is off) c. Overcurrent cleared (dotted line) Note: 1.V BE is the base-emitter voltage in transistors on the IC, and is approximately 0.7 V (see the figure 7.1). For details, see the overall waveform timing diagram.
Figure 6.2 Intermittent Operation Timing Chart
Rev.2.0, Sep.18.2003, page 15 of 33
HA16116FP/FPJ, HA16121FP/FPJ 6.3 Calculating Intermittent Operation Timing Intermittent operation timing is calculated as follows. (1) TON time (the time until the IC is shut off when continuous overcurrent occurs)
TON = CON/OFF x RB x ln 3VBE 2VBE x 1 1 - On duty*
VIN - 2VBE VIN - 3VBE
1 1 - On duty* 0.4 x CON/OFF x RB x 1 1 - On duty*
= CON/OFF x RB x ln1.5 x
(2) TOFF time (when the IC is off, the time until it next goes on)
TOFF = CON/OFF x (RA + RB) x ln Where, VBE 0.7 V
Note: 1. On duty is the percent of time the IC is on during one PWM cycle when the pulse-by-pulse current limiter is operating. From the first equation (1) above, it is seen that the shorter the time TON when the pulse-by-pulse current limiter goes into effect (resulting in a larger overload), the smaller the value TON becomes. As seen in the second equation (2), TOFF is a function of VIN. Further, according to this setting, when VIN is switched on, the IC goes on only after TOFF has elapsed.
Dead band voltage Point at which current limiter operate
Triangle wave
PWM output (step-down channel) tON
On duty = T
tON T
Where T = 1/fOSC
Note: On duty is the percent of time the IC is on during one PWM cycle when the pulse-by-pulse current limiter is operating.
Figure 6.3
Rev.2.0, Sep.18.2003, page 16 of 33
HA16116FP/FPJ, HA16121FP/FPJ 6.4 Examples of Intermittent Operation Timing (calculated values)
(1) TON TON = T1 x CON/OFF x RB Here, coefficient T1 = 0.4 x 1 1 - On duty T1 1 Example: If CON/OFF = 2.2 F, RB = 4.7 k, and the on duty of the current limiter is 75%, then TON = 16 ms. 3 4
2
from section 6.3 (1) previously.
0 0 20 40 60 80 100 (PWM) ON Duty (%)
Figure 6.4 Examples of Intermittent Operation Timing (1)
(2) TOFF TOFF = T2 x CON/OFF x (RA + RB) Here, coefficient T2 = ln VIN - 2VBE VIN - 3VBE T2 0.05 0.1
from section 6.3 (2) previously.
Example: If CON/OFF = 2.2 F, RB = 4.7 k, RA = 390 k, VIN = 12 V, 0 then TOFF = 60 ms.
0
10
20 VIN (V)
30
40
Figure 6.5 Examples of Intermittent Operation Timing (2)
Rev.2.0, Sep.18.2003, page 17 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Triangle wave VCT Dead band VDB Error output VE/O PWM pulse output (In case of HA16120) Power MOS FET drain current (ID) (dotted line shows inductor current) VIN Current limiter pin (CL) VIN - 0.2 V IC
Example of step-up circuit VIN CF RF CL OUT RCS Inductor L ID VOUT
F.B. Determined by L and VIN VTH (CL) Determined by RCS and RF
Figure 6.6 7. ON/OFF Pin Usage OFF 7.1 IC Shutoff by the ON/OFF Pin OFF As shown in the figure 7.1, these ICs can be turned off safely by lowering the voltage at the ON/OFF pin to below 2VBE. This feature is used to conserve the power in the power supply system. In off state the IC current consumption (IOFF) is 10 A (Max) for HA16116 and 150 A (Max) for HA16121. The ON/OFF pin can also be used to drive logic ICs such as TTL or CMOS with a sink current of 50 A (Typ) at an applied voltage of 5 V. When it is desired to employ this feature along with intermittent operation, an open collector or open drain logic IC should be used.
VIN IIN RA External logic IC Off On RB P.VIN S.VIN To output stage To latch 50 k Switch
+ -
To other circuitry Q1 Q2 Q3
TIM
ON/OFF
4 VBE CON/OFF GND
Vref generation circuit Q4
Vref output
HA16116, HA16121
On/off hysteresis circuit
Figure 7.1 IC Shutoff by the ON/OFF Pin OFF
Rev.2.0, Sep.18.2003, page 18 of 33
HA16116FP/FPJ, HA16121FP/FPJ 7.2 Adjusting UVL Voltage (when intermittent operation is not used) The UVL voltage setting in this IC series can be adjusted externally as shown below. Using the relationships shown in the figure, the UVL voltage in relation to VIN can be adjusted by changing the relative values of VTH and VTL. When the IC is operating, transistor Q4 is off, so VON = 3VBE 2.1 V. Accordingly, by connecting resistors RC and RD, the voltage at which UVL is cancelled is as follows.
VIN = 2.1 V x RC + RD RD
This VIN is simply the supply voltage at which the UVL stops functioning, so in this state Vref is still below 2.5 V. In order to restore Vref to 2.5 V, a VIN of approximately 4.3 V should be applied. With this IC series, VON/OFF makes use of the VBE of internal transistors, so when designing a power supply system it should be noted that VON has a temperature dependency of around -6 mV/C.
VIN P.VIN RC TIM (open) ON/OFF Q1 50 k RD Q2 Q3 GND Vref generation circuit Q4 On/off hysteresis circuit Vref output To output stage To latch S.VIN To other circuitry
3 2 Vref 1 0 VOFF 1.4 V
2.5 V VIN 4.5 V VON 2.1 V
0
1
2
3
4
5
VON/OFF
Figure 7.2 Adjusting UVL Voltage
Rev.2.0, Sep.18.2003, page 19 of 33
HA16116FP/FPJ, HA16121FP/FPJ Overcurrent Detection Value Setting The overcurrent detection value VTH for this IC series is 0.2 V (Typ) and the bias current is 200 A (Typ) The power MOS FET peak current value before the current limiter goes into operation is derived from the following equation.
ID = VTCL - (RF + RCS) IBCL RCS
Here VTH = VIN - VCL = 0.2 V, VCL is a voltage referd on GND. Note that CF and RCS form a low-pass filter, determined by their time constants, that prevents malfunctions from current spikes when the power MOS FET is turned on or off.
S.VIN VCL To other circuitry CL
CF 1800 PF IBCL RF 240 G D This circuit is an example for step-down output use. S VO
+ -
RCS 0.05
VIN
1k 200 A
OUT
Detection output (internal)
-+
IN(-)
Figure 8.1 Example for Step-Down Use The sample values given in this figure are calculated from the following equation.
ID = 0.2 V - (240 + 0.05 ) x 200 A 0.05 = 3.04 [A]
The filter cutoff frequency is calculated as follows.
fC = 1 2 CF RF = 1 6.28 x 1800 pF x 240 = 370 [kHz]
Rev.2.0, Sep.18.2003, page 20 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Absolute Maximum Ratings
(Ta = 25C)
Rating Item Supply voltage Output current (DC) Output current (peak) Current limiter pin voltage Error amp input voltage E/O input voltage RT pin source current TIM pin sink current Power dissipation*
1
Symbol VIN IO IO peak VCL VIEA VIE/O IRT ITM PT Topr TjMax Tstg
HA16116FP, HA16121FP 40 0.1 1.0 VIN VIN Vref 500 20 680*
1
HA16116FPJ, HA16121FPJ 40 0.1 1.0 VIN VIN Vref 500 20 680*
1
Unit V A A V V V A mA mW C C C
Operation temperature range Junction temperature Storage temperature range Note:
-40 to +85 125 -55 to +125
-40 to +85 125 -55 to +125
1. This value is based on actual measurements on a 40 x 40 x 1.6 mm glass epoxy circuit board. At a wiring density of 10%, it is the permissible value up to Ta = 45C, but at higher temperatures this value should be derated by 8.3 mW/C. At a wiring density of 30% it is the permissible value up to Ta = 64C, but at higher temperatures it should be derated by 11.1 mW/C.
Permissible dissipation PT (mW)
800 680 mW 600 447 mW 400 348 mW
10% wiring density 30% wiring density
200
45C
64C
85C
125C
0 -40
-20
0
20
40
60
80
100
120
140
Operating ambient temperature Ta (C)
Rev.2.0, Sep.18.2003, page 21 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Electrical Characteristics
(Ta = 25C, VIN = 12 V, fOSC = 300 kHz)
Item Reference voltage block Output voltage Line regulation Load regulation Output shorting current Vref OVP voltage Output voltage temperature dependence Triangle wave oscillator block Maximum oscillator frequency Minimum oscillator frequency Oscillator frequency input voltage stability Oscillator frequency temperature stability Oscillator frequency Dead band adjust block Low-level threshold voltage High-level threshold voltage Threshold differential voltage Output source current PWM comparator block Low-level threshold voltage High-level threshold oltage Threshold differential voltage Dead band precision Symbol Vref Line Load IOS Vrovp Vref/Ta Min 2.45 -- -- 10 6.2 -- Typ 2.50 30 30 25 6.8 100 Max 2.55 60 60 -- 7.0 -- Unit V mV mV mA V ppm/C Test Conditions IO = 1 mA 4.5 V VIN 40 V 0 IO 10 mA Vref = 0 V
fOSCmax fOSCmin fOSC/VIN fOSC/Ta fOSC VTLDB VTHDB VTDB IOsource (DB) VTLCMP VTHCMP VTCMP DBdev
600 -- -- -- 270 0.87 1.48 0.55 100 0.87 1.48 0.55 -5
-- -- 1 5 300 0.97 1.65 0.65 150 0.97 1.65 0.65 0
-- 1 3 -- 330 1.07 1.82 0.75 200 1.07 1.82 0.75 +5
kHz Hz % % kHz V V V A V V V % 4.5 V VIN 40 V -20C Ta 85C CT = 220 pF, RT = 10 k) Output on duty 0% Output on duty 100% VTH = VTH - VTL DB pin = 0 V Output on duty = 0% Output on duty = 100% VTH = VTH - VTL Deviation when VEO = (VTL + VTH)/2, duty = 50 %
Rev.2.0, Sep.18.2003, page 22 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Electrical Characteristics (cont.)
(Ta = 25C, VIN = 12 V, fOSC = 300 kHz)
Item Error amp block Input offset voltage Input bias current Output sink current Output source current Voltage gain Unity gain band-width High-level output voltage Low-level output voltage Overcurrent detection block Threshold voltage CL bias current Operating time Symbol VIOEA IBEA IOsink (EA) IOsource (EA) AV BW VOHEA VOLEA VTCL IBCL tOFFCL Min -- -- 28 28 40 3 2.2 -- VIN-0.22 150 -- -- Output stage Output low voltage VOL1 -- -- -- Off state low voltage VOL2 -- Typ 2 0.8 40 40 50 4 3.0 0.2 VIN-0.2 200 200 500 0.7 1.6 1.0 1.6 Max 10 2 52 52 -- -- -- 0.5 VIN-0.18 250 300 600 2.2 1.9 1.3 1.9 Unit mV A A A dB MHz V V V A ns ns V V V V CL = VIN CL = VIN -0.3 V Applies only to ch 2 of HA16121 IOsink = 10 mA Applies only to HA16116 IOsink = 10 mA Applies only to HA16121 IOsink = 0 mA Applies only to HA16121 IOsink = 1 mA ON/OFF pin = 0 V Applies only to ch 2 of HA16121 IOsink = 0 mA ON/OFF = 0 V Applies only to ch 2 of HA16121 IOsource = 10 mA IOsource = 0 A IOsource = 1 mA ON/OFF pin = 0 V IOsource = 0 A ON/OFF pin = 0 V CL = 1000 pF (to VIN) *1, *2 CL = 1000 pF (to VIN) *1, *2 IO = 10 A IO = 10 A In open loop, VI = 3 V, VO = 2 V In open loop, VI = 2 V, VO = 1 V f = 10 kHz Test Conditions
--
1.0
1.3
V
Output high voltage
VOH1
VIN-1.9 VIN-1.3
VIN-1.6 VIN-1.0 VIN-1.6 VIN-1.0 70 70
-- -- -- -- 130 130
V V V V ns ns
Off state high voltage
VOH2
VIN-1.9 VIN-1.3
Rise time Fall time
tr tf
-- --
Rev.2.0, Sep.18.2003, page 23 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Electrical Characteristics (cont.)
(Ta = 25C, VIN = 12 V, fOSC = 300 kHz)
Item UVL block VIN high-level threshold voltage VIN low-level threshold voltage VIN threshold differential voltage Vref high-level threshold voltage Vref low-level threshold voltage Vref threshold differential voltage ON/OFF block ON/OFF pin sink current IC on-state voltage IC off-state voltage ON/OFF threshold differential voltage TIM block TIM pin sink current in steady state TIM pin sink current at overcurrent detection Common block Operating current Symbol VTUH1 VTUL1 VTU1 VTUH2 VTUL2 VTU2 ION/OFF VON VOFF VON/OFF ITIM1 ITIM2 IIN Min 3.3 3.0 0.1 1.7 1.4 0.1 -- 1.8 1.1 0.5 0 10 6.0 8.5 11.0 Off current IOFF 0 0 Typ 3.6 3.3 0.3 2.0 1.7 0.3 35 2.1 1.4 0.7 -- 15 8.5 12.1 15.7 -- 120 Max 3.9 3.6 0.5 2.3 2.0 0.5 50 2.4 1.7 0.9 10 20 11.1 15.7 20.5 10 150 Unit V V V V V V A V V V A mA mA mA mA A A CL pin = VIN, VTIM = 0.3 V CL pin = VIN - 0.3 V VTIM = 0.3 V CL = 0 pF (to VIN) *1, *2 CL = 500 pF (to VIN) *1, *2 CL = 1000 pF (to VIN) *1, *2 HA16116FP HA16121FP ON/OFF pin = 0 V VTU2 = VTUH2 - VTUL2 ON/OFF pin = 5 V VTU1 = VTUH1 - VTUL1 Test Conditions
Notes: 1. CL is load capacitor for Power MOS FET's gate, and CL = 1000 pF to GND in the case of HA16121 - ch 2. 2. CL in channel 2 of HA16121 is connected to GND.
Rev.2.0, Sep.18.2003, page 24 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Characteristic Curves
* Reference Voltage Block (Vref)
Reference Voltage vs. Power Supply Input Voltage 3
Reference voltage Vref (V) Reference voltage Vref (V)
Ta = 25C RA = 390 k (Between the VIN and ON/OFF pins)
Vref Temperature Characteristics
2.54 VIN = 12 V IO (Vref) = 1 mA 2.52
2.5 V
2
UVL release: 3.6 V UVL operate: 3.3 V
2.50
1 3.3 3.6 0 4.3 40
2.48 85 0 20 40 60 80 100 Ambient temperature Ta (C)
1 2 3 4 5 Power supply input voltage VIN (V)
2.46 -20
Vref Load Regulation
3.0
Reference voltage Vref (V)
2.5
2.0
1.50
0 10 20 Output current IO sink (mA)
Short circuit current 30
* UVL (Low Input Voltage Malfunction Prevention) Block
Hysteresis Voltage Temperature Characteristics
4.5 High threshold voltage 4.0
VIN UL voltage (V)
3.5
Hysteresis
3.0
Low threshold voltage
2.5
-20
0
20 40 60 80 Ambient temperature Ta (C)
100
Rev.2.0, Sep.18.2003, page 25 of 33
HA16116FP/FPJ, HA16121FP/FPJ * Triangle Wave Oscillator Block
1.1
RT pin Output Current Characteristics
Sawtooth wave level (V)
Sawtooth Wave Amplitude vs. Oscillator Frequency
2.0 VTH 1.5 VTL Sawtooth wave amplitude
RT pin voltage (V)
1.0
1.0
0.9 Reccomended usage range 10 (RT 100 k) 0.8 0 100 200
0.5
Note: Due to these characteristics, the dead band and PWM comparator threshold voltages change at high frequencies.
330 (RT 3 k) 300 400 500 0 (DC) 100 200 300 400 500 600
IRT (A)
fOSC (kHz) (linear scale)
100 70 50
RT (k)
CT, RT Values (VIN = 12V) vs. Oscillator Frequency
C
10
0 pF
T
=
F
47
30 20
22 10 47 00 .1 F 00 pF 47 00 pF 0 pF
22
0p
pF
600 kHz
10 7 5 3 10
00
pF
20
30
50 70 100 200 300 Oscillator frequency fOSC (kHz)
500 700 1 M
Oscillator Frequency Temperature Stability
+10
Frequency variation (f/fo) (%)
VIN = 12 V +5 B 0 -5 -10 -20 A
A: fOSC = 300 kHz B: fOSC = 600 kHz
A B 85
0
20 40 60 Ambient temperature Ta (C)
80
100
Rev.2.0, Sep.18.2003, page 26 of 33
HA16116FP/FPJ, HA16121FP/FPJ * Error Amplifier Block
Open Loop Gain Characteristics
60
Open loop gain AVO (dB)
AVO 40 0 45 90
20
135 BW 0 1k 3k 10 k 30 k 100 k 300 k 1M 3M 180 10 M
Error amplifier input frequency fIN (Hz)
Common Mode Input Characteristics
+100
Output offset VO (mV)
0
- EA +
-100 VI Vref -200
VO -+
-300
0
1
2 3 Input voltage VI (V)
4
* On Duty Characteristics
On Duty Characteristics
100 Step-down PWM output (HA16116-1, 2ch HA16121-1ch) 100
On Duty Characteristics
Boost PWM output (HA16121-2 ch)
Hz
=5
0
kH z
0k
80
80
On duty*1 (%)
SC
60
60
fO
0
On duty*2 (%)
k
Hz
30
60
0
z
40
40
kH z
kH
30
20
20
0 0.8
1.0
1.2 1.4 VDB or VE/O (V)
1.6
1.8
0 0.8
1.0
fO
1.2 1.4 VDB or VE/O (V)
SC
=5
0k
0
Hz
60
1.6
Phase delay (deg.)
1.8
Notes: 1. The percentage of a single timing cycle during which the output is low.
2. The percentage of a single timing cycle during which the output is high.
Rev.2.0, Sep.18.2003, page 27 of 33
HA16116FP/FPJ, HA16121FP/FPJ * Other Characteristics
Current Limiter Level Temperature Characteristics
220
Detection voltage VTH (mV)
IC On Voltage and Off Voltage Temperature Characteristics
4
VON or VOFF (V)
210 85C
3 VON on voltage (about -6mV/C) 2 VOFF off voltage (about -4mV/C) 85C
200
190
1
180 -20
0
20 40 60 Ambient temperature Ta (C)
80
100
0 -20
0 20 40 60 80 Ambient temperature Ta (C)
100
IIN vs. VIN Characteristics
40 fOSC = 300 kHz On duty: 50% Ta = 25C 30
Current dissipation IIN (mA)
Output pin (Output Resistor) Characteristics
12 Output high voltage when on Output high voltage when off (channels 1 and 2 in the HA16116 and channel 1 in the HA16121) VGS (P-channel Power MOS FET)
Maximum rating at Ta = 25C: 680 mW
Output voltage VO (VDC)
11
10
Load capacitance: 1000 pF/ch 20 500 pF/ch
9
3 Output low voltage when on 2 Output low voltage when off (channels 1 and 2 in the HA16121)
No load 10
1
0
10 20 30 Power supply voltage VIN (V)
40
0
2
4 6 8 IO sink or IO source (mA)
10
VGS (N-channel Power MOS FET)
Output Drive Circuit Power MOS FET Direct Drive ability Data
800 VIN = 12 V fOSC = 130 kHz 600
IO peak (mA)
Gate Drive Waveforms for the 2SJ214
2SJ214 400
2SJ176
2SJ216
Drive voltage: 5 V/div
200 Drive current: * 200 mA/div 1000 2000 Ciss (pF) Note: The solid line is data measured with discrete capacitances (for each channel of HA16116). 3000 4000 650 nsec/div Note: * Measured using a current probe. (The boost channel (channel 2 in the HA16121) load is with respect to ground, and has almost identical characteristics.)
0
Rev.2.0, Sep.18.2003, page 28 of 33
HA16116FP is used in a 5 V output power supply, with a +12 V input.
RA 390k 4700p 24k 1800p 33k 4.7 2SJ214 + 330H HRP24
Vref
VIN 0.05
12V 10k 240 100k + 2.2 - RB 4.7k CTM 2.2 S.VIN
TIM
ON/OFF IN(-)2
Cref 0.1
Vref
E/O2 DB2 CL2 OUT2 P.VIN
20
IN
Application Examples (1)
19
- EA2 + from UVL VIN 5k UVL H OUT2* from UVL OR NAND (HA16116) L V L VH OVP PWM COMP 2 -+ CL2 0.2 V
18
+ 470 -
17
16
15
14
13 to S.V 12
11
20k 20k Step-down output
Rev.2.0, Sep.18.2003, page 29 of 33
+5 V 1A output - UVL output
0.8V + + - VIN VIN from UVL 0.8V
1.6 V
HA16116FP/FPJ, HA16121FP/FPJ
2.5 V output band gap reference voltage ON/OFF generation circuit
Triangle wave oscillator circuit
Latch
S R 0.8V PWM COMP 1 Vref 5k from UVL Q
NAND OUT1
- + +
Inverting output
-
5k
1.0 V
from UVL
Triangle wave Latch reset pulse Bias current
1.1 V RT + EA1 -
330H
+ - 470
-5 V 1A output
CL1 -+ 0.2 V to S.VIN
+ HRP24
1
S.GND
IN(+)1 IN(-)1
2
CT RT E/O1
3
100k 33k 4700p 10k 12k 12k
4
5
6
7
DB1
- +
8
9
CL1 OUT1
10
P.GND
2SJ214 4.7 2.2 24k R3 2k R4 12k 1800p
CT 220p RT 10k
240 0.05
Units: R : C : F (unless otherwise specified) pF (p) The IC is the HA16116.
HA16116FP/FPJ, HA16121FP/FPJ
Overall Waveform Timing Diagram (for Application Examples (1))
12 V VIN 0V 2.8 V 2.1 V VTIM, VON/OFF 2.1 V 1.4 V
VTIM, VON/OFF 0V
On (V) 3.0 VE/O Off 2.0 VE/O, VCT, VDB 1.0 VDB 0.0 VCL 12 V 11.8 V 0V Pulse-by-pulse current limiter operates VOUT*1 12 V PWM pulse 0 V DC/DC output (example for positive voltage) Soft start IC operation states Power IC on supply on Steady-state operation Overcurrent detected; intermittent operation Overcurrent Quick cleared; shut-off steady-state operation Power supply off, IC off VCT triangle wave Off On On On Off Off Off On
Note: 1.This PWM pulse is on the step-down/inverting control channel. The booster control channel output consists of alternating L and H of the IC OonO cycle.
Rev.2.0, Sep.18.2003, page 30 of 33
HA16116FP/FPJ, HA16121FP/FPJ
Application Examples (2) (Some Pointers on Use)
1. Inductor, Power MOS FET, and Diode Connections
1. Booster specification VIN CF VIN CL RF RCS Applicable only to channel 2 of HA16121FP VO OUT GND FB 3. Inverting specification CF VIN CL OUT VO GND FB Vref GND FB RF RCS Applicable only to channel 1 GND FB 4. Negative booster specification (Flyback transformer) CF VIN CL OUT RF RCS Applicable only to channel 1 2. Step-down specification VIN CF VIN CL OUT RF RCS Applicable to HA16116FP and to channel 1 of HA16121FP VO
2. Turning Output On and Off while the IC is On
1. To turn only one channel off, ground the DB pin or the E/O pin. In the case of E/O, however, there will be no soft start when the output is turned back on. DB E/O OFF 2. When only one channel is to be used, the channel not used should be connected as follows.
VIN Connect CL to VIN. Ground IN(+) and IN(-). Leave other pins open.
CL
IN + IN - GND
Rev.2.0, Sep.18.2003, page 31 of 33
Power supply using the HA16121FP: +5 V input, +12 and -22 V outputs
VIN RA 390k 24k RB 4.7k 4700p 10k 33k
- +
5V
Cref 0.1 0.05
1800p 2.2 330H 240
CTM 2.2 20
from UVL 0.2 V VIN 5k Vref UVL H OUT2* from UVL OR NAND (HA16116) L VL VH OVP PWM COMP 2 -+ CL2
Application Examples (3)
S.VIN 19 18 TIM 17 16 15 14 13 11 ON/OFF E/O2 DB2 CL2 OUT2 12 to S.VIN 4.7 HRP24 P.VIN
Vref
100k IN(-)2
+ 5.1 k
+
- EA2 +
470 - 2SK1094 1.3 k Boost output
Rev.2.0, Sep.18.2003, page 32 of 33
+12 V output - UVL output
0.8V + + - VIN VIN from UVL 0.8V
1.6 V
HA16116FP/FPJ, HA16121FP/FPJ
2.5 V band gap reference voltage ON/OFF generation circuit
Triangle wave generation circuit Latch
S R 0.8V PWM COMP 1 Vref 5k from UVL Q - + + 5k
1.0 V
NAND OUT1
from UVL
Triangle wave Latch reset pulses Bias current
1.1 V RT + EA1 -
Inverting output
+
CL1 -+ 0.2 V to S.VIN
330H
+ -
470
-12 V output -
1 S.GND CT RT RT 10k 4700p 10k CT 220p IN(+)1 IN(-)1 100k 33k
2
3
4
5
6
E/O1
- +
7
DB1
8
CL1
9
OUT1
10
P.GND 4.7 2.2 24k 1800p 240 0.05 2SJ214
12k 12k R3 1.2k
Units: R : C : F (unless otherwise specified) pF (p) The IC is the HA16121.
R4 22k
HA16116FP/FPJ, HA16121FP/FPJ
Package Dimensions
As of January, 2003
12.6 13 Max
20
Unit: mm
11
5.5
1
10
2.20 Max
*0.22 0.05 0.20 0.04
0.20 7.80 + 0.30 -
0.80 Max
1.15
1.27
*0.42 0.08 0.40 0.06
0.10 0.10
0 - 8
0.70 0.20
0.15
0.12 M
*Dimension including the plating thickness Base material dimension
Package Code JEDEC JEITA Mass (reference value)
FP-20DA -- Conforms 0.31 g
Rev.2.0, Sep.18.2003, page 33 of 33
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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